High Purity Silicon Target Material: Core Material for Thin Film Deposition

Silicon target material is used in physical vapor deposition (PVD) processes, primarily for depositing medium layers such as silicon oxide, silicon nitride, and silicon hydride. It can be divided into crystalline silicon and HSi types. Silicon targets are typically dark gray with a semi-metallic appearance and a density of about 2.33 g/cm³. The melting point of silicon is 1414°C, and its boiling point is 3265°C. Silicon has a high thermal conductivity coefficient (149 W·m⁻¹·K⁻¹) and excellent thermal conductivity. Additionally, silicon target material has good hardness, optical properties, wear resistance, and excellent corrosion resistance.

Excellent Properties of Silicon Target Material:

l High Purity Ensures Stable Thin Film Performance

Crystalline silicon has a purity of 99.999%, while HSi purity is 99.99%

l Excellent Thin Film Uniformity and Density

Silicon targets have a high sputtering efficiency and are compatible with various vacuum coating equipment in the PVD process. At the same time, silicon atoms have good adhesion to common substrates (such as glass, metal, silicon wafers), forming stable, non-peeling films that meet high reliability requirements.

l Good Sputtering Rate and Adhesion

The good thermal conductivity of silicon helps dissipate heat from the target surface quickly, preventing local overheating. Also, its conductivity is essential for magnetron sputtering, aiding in efficient film deposition.

Wide Applications of Silicon Target Material

l Optical Device Manufacturing

High Purity: Silicon targets ensure the clarity, stability, and accuracy of optical devices, enhancing their performance and reliability. Anti-reflection and protective layers: In fiber optic communications and integrated optical circuits, silicon dioxide films are used as waveguide materials to transmit and process optical signals.

l Semiconductor Manufacturing

Used to prepare substrates and packaging materials for LEDs, providng improvement in the luminous efficiency and stability of LEDs.

l Sensor Manufacturing

Used in the production of sensor elements and signal processing circuits, enhancing the sensitivity and accuracy of sensors

Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people.

APG specializes in the research and development (R&D) and production of PVD materials (sputtering targets and evaporation materials), pastes, and powders. These products serve industries such as PV solar cells, optics, semiconductors, smart touch and display manufacturing, Low-E glass production, permanent magnets, power batteries, and decorative and functional coating applications.

APG utilizes leading production technologies, including sintering, plasma spraying, and melting. The company produces ceramic materials, compound materials, metals, and alloy materials, and also provides bonding and backing plate services. APG possesses the necessary technology and equipment to produce both powder and pastes.

APG maintains a strong technical team and R&D department, which accounts for more than 20% of the company's total employees. This team focuses on developing new materials and technologies and holds numerous patents. Additionally, APG operates an inspection center equipped with various instruments to guarantee the stable quality of all products. APG is committed to the research, development, and production of high-performance materials and delivering excellent service to its customers.